Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2011-04-19
2011-04-19
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S199000, C438S622000
Reexamination Certificate
active
07927933
ABSTRACT:
The present invention relates generally to integrated circuit (IC) fabrication processes. The present invention relates more particularly to the treatment of surfaces, such as silicon dioxide or silicon oxynitride layers, for the subsequent deposition of a metal, metal oxide, metal nitride and/or metal carbide layer. The present invention further relates to a high-k gate obtainable by a method of the invention.
REFERENCES:
patent: 6255230 (2001-07-01), Ikakura et al.
patent: 6407435 (2002-06-01), Ma et al.
patent: 6506668 (2003-01-01), Woo et al.
patent: 6620720 (2003-09-01), Moyer et al.
patent: 6642573 (2003-11-01), Halliyal et al.
patent: 6727590 (2004-04-01), Izumitani et al.
patent: 6875681 (2005-04-01), Bohr
patent: 7071066 (2006-07-01), Wang et al.
patent: 7307346 (2007-12-01), Kaltalioglu et al.
patent: 2002/0016084 (2002-02-01), Todd
patent: 2002/0094698 (2002-07-01), Li et al.
patent: 2002/0137274 (2002-09-01), Lee et al.
patent: 2002/0192889 (2002-12-01), Akram et al.
patent: 2003/0075756 (2003-04-01), Suzuki
patent: 2003/0082296 (2003-05-01), Elers et al.
patent: 2003/0129826 (2003-07-01), Werkhoven et al.
patent: 2003/0199137 (2003-10-01), Lee et al.
patent: 2003/0219993 (2003-11-01), Wu et al.
patent: 2004/0067660 (2004-04-01), Wilk et al.
patent: 2004/0203254 (2004-10-01), Conly, Jr. et al.
patent: 2004/0248392 (2004-12-01), Narwankar et al.
patent: 2005/0145177 (2005-07-01), McSwiney et al.
patent: 2006/0051920 (2006-03-01), Yamaguchi et al.
patent: 2006/0125028 (2006-06-01), Chen et al.
patent: 2006/0128150 (2006-06-01), Gandikota et al.
patent: 2006/0141729 (2006-06-01), Wang et al.
patent: 2006/0182885 (2006-08-01), Lei et al.
patent: 2006/0212471 (2006-09-01), Lundberg et al.
patent: WO 02/43115 (2002-05-01), None
International Search Report for Equivalent European Application 05447030.7, mailed on Aug. 24, 2005.
Koh et al. “Meeting the Cu diffusion barrier challenge using ALD tungsten nitride carbide” Solid State Technology, pp. 54-58, Jun. 2005.
Travaly et al. “Characterization of atomic layer deposited nanoscale structure on dense dielectric substrates by X-ray reflectivity” Microelectronic Engineering 82 (2005) pp. 639-644.
Delabie Annelies
Maes Jan Willem
Shimamoto Yashuhiro
ASM International
IMEC
Knobbe Martens Olson & Bear LLP
Landau Matthew C
Mitchell James M
LandOfFree
Method to enhance the initiation of film growth does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method to enhance the initiation of film growth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to enhance the initiation of film growth will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2734304