Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-08-14
2007-08-14
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S618000
Reexamination Certificate
active
11024917
ABSTRACT:
A method of forming a metal layer with reduced defects comprising providing a structure having a dielectric layer formed over it, forming a dielectric layer having an opening, lining the opening with a metal seed layer, treating the metal seed layer with a cleaning process to remove contaminates from it, and forming a metal layer upon the metal seed layer.
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Cheng Hsi-Kuei
Cheng Min-Yuan
Feng Hsien-Ping
Lin Steven
Liu Chi-Wen
Duane Morris LLP
Perkins Pamela E
Taiwan Semiconductor Manufacturing Co.
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