Method to control uniformity using tri-zone showerhead

Details Method to control uniformity using tri-zone showerhead Method to control uniformity using tri-zone showerhead

2008-02-28

2011-11-29

Culbert, Roberts (Department: 1716)

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

C438S710000

Reexamination Certificate

active

08066895

ABSTRACT:
Embodiments of the present invention provide apparatus and method for processing a substrate with increased uniformity. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus comprises a chamber body defining a processing volume, a substrate support disposed in the processing volume, a showerhead disposed in the processing volume opposite to the substrate support, and a plasma generation assembly configured to ignite a plasma from the processing gases in the processing gas in the processing volume. The showerhead is configured to provide one or more processing gases to the processing volume. The showerhead has two or more distribution zones each independently controllable.

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