Method of substrate processing to form a film on multiple target

Details Method of substrate processing to form a film on multiple target Method of substrate processing to form a film on multiple target

1996-08-05

2000-04-25

Beck, Shrive

Coating processes

Centrifugal force utilized

4273762, 4274193, B05D 312

Patent

active

060541814

ABSTRACT:
A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

REFERENCES:
patent: 4416930 (1983-11-01), Kelly
patent: 4731293 (1988-03-01), Ekholm et al.
patent: 4732785 (1988-03-01), Brewer
patent: 4826709 (1989-05-01), Ryan et al.
patent: 5120580 (1992-06-01), Lesher et al.
patent: 5314724 (1994-05-01), Tsukune et al.
patent: 5371046 (1994-12-01), Liaw et al.

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