Method of removing surface protrusions from thin films

Details Method of removing surface protrusions from thin films Method of removing surface protrusions from thin films

1996-10-07

1999-05-11

Chang, Ceila

Etching a substrate: processes

Etching of semiconductor material to produce an article...

257 10, 313495, H01L29/12;29/06

Patent

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059024917

ABSTRACT:
A method for removing a surface protrusion projecting from a layer of a first material deposited on a surface of a substrate. In accordance with one embodiment of the invention, a layer of a second material is applied on the layer of first material. A sufficient quantity of the second material is removed to expose the surface protrusion. The first material exposed through the surface protrusion is then removed.

REFERENCES:
patent: 4940916 (1990-07-01), Borel et al.
patent: 5186670 (1993-02-01), Doan et al.
patent: 5210472 (1993-05-01), Casper et al.
patent: 5229331 (1993-07-01), Doan et al.
patent: 5252881 (1993-10-01), Muller
patent: 5259799 (1993-11-01), Doan et al.
patent: 5372973 (1994-12-01), Doan et al.
patent: 5445107 (1995-08-01), Roth
patent: 5620350 (1997-04-01), Takemura
patent: 5629580 (1997-05-01), Mandelman
Wolf. et al. "Silicon processing for the vlsi era" Lattice Press pp. vii-xxiv, 1986.

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