Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder shape or size characteristics
Reexamination Certificate
2006-08-01
2006-08-01
Lavilla, Michael E. (Department: 1775)
Powder metallurgy processes
Powder metallurgy processes with heating or sintering
Powder shape or size characteristics
C419S008000, C419S028000, C419S042000, C148S679000, C148S684000, C361S704000, C228S262600, C029S017300, C029S530000
Reexamination Certificate
active
07083759
ABSTRACT:
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10−6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
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International Search Report (May 2001).
Amano Yoshinari
Arikawa Tadashi
Hayashi Hidefumi
Hirayama Norio
Maesato Hidetoshi
A.L.M.T. Corp.
Lavilla Michael E.
Sughrue & Mion, PLLC
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