4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Hidetoshi Maesato

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Heat sink substrate consisting essentially of copper and...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Post sintering operation
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Method of producing a heat dissipation substrate of...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder shape or size characteristics
Reexamination Certificate

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Semiconductor package and method for producing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Semiconductor package and method for producing...

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Heat and pressure simultaneously to effect sintering
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2086636

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