Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2008-07-01
2008-07-01
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S055000, C257S417000, C257S467000, C257SE29324, C257SE21502
Reexamination Certificate
active
07393711
ABSTRACT:
An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electrical connections. The sensor further includes a molded protective resin at least partly covering the substrate and the chip and completely encapsulating the wire-bonding wires. The resin forms, on at least one side of the chip and at most three sides, a bump rising to at least 500 microns above the sensitive surface, this bump encapsulating the wire-bonding wires and constituting a guide for a finger, the fingerprint of which it is desired to detect.
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Bolis Sébastien
Roman Cécile
Atmel Grenoble S.A.
Fish & Richardson P.C.
Zarneke David A
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