Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-08-23
2011-08-23
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S762000, C361S790000, C361S803000, C257S621000, C257S686000, C257S700000, C257S778000, C174S260000, C174S261000, C174S262000, C174S263000, C438S074000, C438S106000, C438S108000
Reexamination Certificate
active
08004848
ABSTRACT:
Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First selection lines are electrically connected to selection terminals of first unit substrates disposed in odd-number layers, pass through some of the unit substrates, and extend to a lowermost substrate of the unit substrates. Second selection lines are electrically connected to selection terminals of second unit substrates disposed in even-number layers, pass through some of the unit substrates, and extend to the lowermost substrate of the unit substrates. The selection terminal is disposed between the first selection lines and the second selection lines.
REFERENCES:
patent: 5130894 (1992-07-01), Miller
patent: 5527716 (1996-06-01), Kusian et al.
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5995379 (1999-11-01), Kyougoku et al.
patent: 6392292 (2002-05-01), Morishita
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6469374 (2002-10-01), Imoto
patent: 6469375 (2002-10-01), Beausoleil et al.
patent: 6492718 (2002-12-01), Ohmori
patent: 6501165 (2002-12-01), Farnworth et al.
patent: 6740981 (2004-05-01), Hosomi
patent: 7352052 (2008-04-01), Imoto et al.
patent: 7365416 (2008-04-01), Kawabata et al.
patent: 7495326 (2009-02-01), Rinne
patent: 7586183 (2009-09-01), Kawabata et al.
patent: 06-342874 (1994-12-01), None
patent: 2001-024151 (2001-01-01), None
patent: 2002-0066095 (2002-08-01), None
English language abstract of Japanese Publication No. 06-342874.
English language abstract of Japanese Publication No. 2001-024151.
English language abstract of Korean Publication No. 2002-0066095.
Baek Seung-Duk
Lee Kang-Wook
Umemoto Mitsuo
Datskovskiy Michael V
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
LandOfFree
Stack module, card including the stack module, and system... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stack module, card including the stack module, and system..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack module, card including the stack module, and system... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2759097