Method of preventing etch profile bending and bowing in high...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S714000, C438S724000, C438S725000

Reexamination Certificate

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07846846

ABSTRACT:
High aspect ratio contact openings are etched while preventing bowing or bending of the etch profile by forming a highly conductive thin film on the side wall of each contact opening. The conductivity of the thin film on the side wall is enhanced by ion bombardment carried out periodically during the etch process.

REFERENCES:
patent: 6187685 (2001-02-01), Hopkins et al.
patent: 6475920 (2002-11-01), Coburn et al.
patent: 6506674 (2003-01-01), Ikeda et al.
patent: 7682986 (2010-03-01), Chi et al.
patent: 7713430 (2010-05-01), Wilson
patent: 2008/0203056 (2008-08-01), Wang et al.

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