Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1995-12-20
1997-11-04
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257695, 257784, H01L 2348, H01L 2352, H01L 2940
Patent
active
056843321
ABSTRACT:
A package for a semiconductor die having a plurality of bonding pads about its periphery is provided. The package has a plastic molding encapsulating the semiconductor die. The package also has a plurality of conductive leads with leads having inner and outer portions, the inner portions encapsulated in the molding and arranged substantially in a plane and radially about the semiconductor die with ends displaced from and forming a rectangle with four corners about the die. A bonding wire extends from each of the bonding pads to one of the inner portions of the leads. Bonding wire loop heights of approximately 8 mils are made with a specially designed tip of a capillary tool. The package also has a pair of leads with inner portions at opposite corners of the rectangle, each of the inner portions connected to a pair of bonding wires from a pair of contiguous bonding pads on the die. This double wiring arrangement prevents wire sweep during the injection molding step. Bonding pad pitches of 4 mils or less on the semiconductor die are possible.
REFERENCES:
patent: 4403240 (1983-09-01), Seki et al.
patent: 4875138 (1989-10-01), Cusack
patent: 5045919 (1991-09-01), Nagaoka
patent: 5359227 (1994-10-01), Lange et al.
patent: 5550087 (1996-08-01), Brossart
Chen C. M.
Chung James
Li Simon
Lin K. T.
Maa Pony
Advanced Semiconductor Engineering Inc.
Aka Gary T.
Arroyo T. M.
Saadat Mahshid D.
LandOfFree
Method of packaging a semiconductor device with minimum bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of packaging a semiconductor device with minimum bonding , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging a semiconductor device with minimum bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1835371