4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

James Chung

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Method of packaging a semiconductor device with minimum bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Robot deployed weapon system and safing method

Data processing: generic control systems or specific application – Specific application – apparatus or process – Robot control
Reexamination Certificate

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Weapon robot with situational awareness

Data processing: generic control systems or specific application – Specific application – apparatus or process – Robot control
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1700246

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