Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating lead frame or beam lead
Patent
1997-04-23
1998-11-17
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating lead frame or beam lead
216 18, 216 56, 216 65, B44C 122
Patent
active
058371540
ABSTRACT:
A method of manufacturing a double-sided circuit tape carrier comprising an insulating film like a polyimide tape, circuit wiring patterns on both sides thereof, and via holes through which at least a part of the circuit wiring patterns on both sides are electrically connected with each other. A copper thin film is patterned by photoetching. Via holes are formed through the insulating film by irradiating a laser beam by using the patterned copper thin film as a mask. Then, a conductive layer of a graphite conductive thin film and a copper plating layer is formed. The copper thin film is patterned by photoetching forming a chip hole and an outer lead hole through the insulating film by irradiating a laser beam. Finally, one of the copper thin films is patterned by photoetching to form circuit wiring pattern.
REFERENCES:
patent: 3823467 (1974-07-01), Shamash et al.
patent: 4908933 (1990-03-01), Sagisaka et al.
Monthly Magazine, "Denshi Zairyo Electronic Materials" Jul. 1989 Translations of pertinent portions on pp. 30, and 31.
Ishikawa Hiroshi
Kameyama Yasuharu
Mita Mamoru
Okabe Norio
Sato Takayuki
Hitachi Cable Ltd.
Powell William
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