4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Norio Okabe

Inventor

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Circuit tape having adhesive film semiconductor device and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Circuit tape having adhesive film, semiconductor device, and a m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Circuit tape having adhesive film, semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Interposer for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Method of manufacturing double-sided circuit tape carrier

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating lead frame or beam lead
Patent

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Profile ID: LFUS-PAI-P-905988

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