4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Mamoru Mita

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Apparatus for applying chemical plating to inner surfaces of tub

Coating apparatus – Control means responsive to a randomly occurring sensed... – Sampling of associated base
Patent

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Circuit tape having adhesive film semiconductor device and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Circuit tape having adhesive film, semiconductor device, and a m

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Circuit tape having adhesive film, semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Composite lead frame with connected inner and outer leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent

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Profile ID: LFUS-PAI-P-905986

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