Method of manufacturing an ILD layer by plasma treatment before

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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H01L21/316

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active

059021225

ABSTRACT:
A method of manufacturing a semiconductor device is provided. A first interlayer insulating layer is formed on a silicon substrate, and a lower metal layer is formed on the first interlayer insulating layer. A first insulating layer is formed on the first interlayer insulating layer including the lower metal layer, moisture contained in the first insulating layer is removed by N.sub.2 or N.sub.2 O plasma. Thereafter, a SOG layer and a second insulating layer are sequentially formed on the first insulating layer.

REFERENCES:
patent: 5270267 (1993-12-01), Ouellet
patent: 5314724 (1994-05-01), Tsukune et al.
patent: 5334554 (1994-08-01), Lin et al.
patent: 5413963 (1995-05-01), Yen et al.
patent: 5484749 (1996-01-01), Maeda et al.
patent: 5554567 (1996-09-01), Wang
patent: 5556806 (1996-09-01), Pan et al.
patent: 5656123 (1997-08-01), Saliman et al.
patent: 5665635 (1997-09-01), Kwon et al.

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