Method of manufacturing a transistor and a method of forming...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S270000, C257SE21540

Reexamination Certificate

active

07442609

ABSTRACT:
A method of manufacturing a transistor. In one embodiment, the method includes forming a gate electrode by defining a gate groove in the substrate. A plate-like portion is defined in each of the trenches at a position adjacent to the groove so that the two plate-like portions will be connected with the groove and the groove is disposed between two plate-like portions. In one embodiment, the two plate-like portions are defined by an etching process which selectively etches the isolating material of the isolation trenches with respect to the semiconductor substrate material. A gate insulating material is provided at an interface between the active area and the groove and the interface between the active area and the plate-like portions, and a gate electrode material is deposited so as to fill the groove and the two plate-like portions.

REFERENCES:
patent: 5945707 (1999-08-01), Bronner et al.
patent: 6037194 (2000-03-01), Bronner et al.
patent: 2005/0003308 (2005-01-01), Frohlich et al.
patent: 102004031385 (2006-01-01), None
Deok-Hyung Lee et al., “Fin-channel-array transistor (FCAT) featuring sub-70-nm low power and high performance DRAM” IEDM Tech. Dig., pp. 407 to 410, 2003 (Abstract Only).

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