Method of manufacturing a micromechanical component

Details Method of manufacturing a micromechanical component Method of manufacturing a micromechanical component

2005-06-14

2005-06-14

Mills, Gregory (Department: 1763)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S041000

Reexamination Certificate

active

06905615

ABSTRACT:
A method of manufacturing a micromechanical component has the steps: providing a substrate having a front side and a back side; structuring the front side of the substrate; at least partially covering the structured front side of the substrate with a protective layer containing germanium; structuring the back of the substrate; and at least partially removing the protective layer containing germanium from the structured front side of the substrate.

REFERENCES:
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patent: 6368885 (2002-04-01), Offenberg et al.
patent: 6440766 (2002-08-01), Clark
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patent: 0 867 702 (1998-09-01), None
B. Li, et al., “Germanium as a Versatile Material for Low-Temperature Micromachining”, Journal of Microelectromechanical Systems, IEEE Inc. New York, vol. 8, No. 4, Dec. 1999, pp. 366-372.

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