4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Physical stress responsive

Udo Bischof

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active

Bonding pad structure and method for manufacturing the bonding p

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Manufacturing method for micromechanical component

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate

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Method for manufacturing a micromechanical component

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Method for manufacturing a rate-of-rotation sensor

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent

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Method of manufacturing a micromechanical component

Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-206560

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