Method of manufacturing a flash memory device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438182, 438195, 438211, 438277, 438283, H01L 21336

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active

060936045

ABSTRACT:
A memory device and a method of manufacturing the same in accordance with the present invention has an improved writing and erasing efficiency and an improved reliability. The memory device includes a first conductivity type substrate having second conductivity type source and drain regions spaced apart from each other. A source electrode having a T-shaped rail structure is formed in contact with the source region, and a drain electrode having a T-shaped rail structure is formed in contact with the drain region. An I-shaped floating gate is formed on the substrate between the source electrode and the drain electrode with a control gate formed on the floating gate.

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Verma, G. and N. Mielke, "Reliability Performance of ETOX Based Flash Memories," Proc. IRPS, 1988, pp. 158-166.

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