Method of manufacture of self-aligned JFET

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438192, H01L 21337

Patent

active

057029873

ABSTRACT:
A JFET device is formed on a semiconductor body comprising an active region for the junction field effect device. A drain region layer is formed below the lower portion of the active region. The top surface of the body is doped to provide a source region layer on the device. Gate trenches extend through the source region layer forming source regions therein. The gate trenches also extend partially through the epitaxial layer. The gate trenches have sidewalls and bottoms. Dielectric spacer layers cover the sidewalls of the gate trenches upon surfaces of the source layer and the epitaxial layer in the gate trenches. Self-aligned gate regions are formed at the bottoms of the gate trenches in doped portions of the active region.

REFERENCES:
patent: 4476622 (1984-10-01), Cogan
patent: 4543706 (1985-10-01), Bencuya et al.
patent: 4566172 (1986-01-01), Bencuya et al.
patent: 4611384 (1986-09-01), Bencuya et al.
patent: 4713358 (1987-12-01), Bulat et al.
patent: 5243209 (1993-09-01), Ishii
patent: 5260227 (1993-11-01), Farb et al.
patent: 5294814 (1994-03-01), Das
Ghandhi, "VLSI Fabrication Principles Silicon and Gallium Arsenide", pp. 19-21, John Wiley & Sons, 1994 Month Unknown.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacture of self-aligned JFET does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacture of self-aligned JFET, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of self-aligned JFET will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-201958

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.