Method of loading a wafer onto a wafer holder to reduce...

Details Method of loading a wafer onto a wafer holder to reduce... Method of loading a wafer onto a wafer holder to reduce...

2005-03-01

2005-03-01

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S792000, C438S795000, C118S724000, C118S725000, C118S727000

Reexamination Certificate

active

06861321

ABSTRACT:
One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hspurge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

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