Method of forming semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S201000, C438S287000, C438S769000, C438S773000, C438S775000, C257SE21180

Reexamination Certificate

active

07550353

ABSTRACT:
One embodiment of a method for forming a semiconductor device can include forming a gate pattern on a semiconductor substrate and performing a selective re-oxidation process on the gate pattern in gas ambient including hydrogen, oxygen, and nitrogen. When the gate pattern includes a tunnel insulation layer, a metal nitride layer and a metal layer, the selective re-oxidation process heals the etching damage of a gate pattern and simultaneously prevents oxidation of the metal nitride layer and a tungsten electrode.

REFERENCES:
patent: 6617639 (2003-09-01), Wang et al.
patent: 6627494 (2003-09-01), Joo et al.
patent: 2001/0025971 (2001-10-01), Powell
patent: 2004/0121526 (2004-06-01), Yamamoto
patent: 2005/0227437 (2005-10-01), Dong et al.
patent: 2006/0054943 (2006-03-01), Li et al.
patent: 2007/0048917 (2007-03-01), Yamamoto et al.
patent: 2002-0049352 (2002-06-01), None
patent: 10-2002-0075000 (2002-10-01), None
patent: 2005-0003533 (2005-01-01), None
patent: 2006-0041553 (2006-05-01), None
patent: 10-2006-0075238 (2006-07-01), None
patent: 10-2006-0100092 (2006-09-01), None
patent: 10-2006-0109542 (2006-10-01), None
English language abstract of Korean Publication No. 2005-0003533.
English language abstract of Korean Publication No. 2006-0041553.

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