Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-04-18
2000-03-14
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438239, 438253, 438287, 438396, H01L 2170
Patent
active
060372052
ABSTRACT:
A method of forming a capacitor for a semiconductor device includes the steps of forming a gate electrode on a semiconductor substrate, forming an impurity diffused region on portions of the semiconductor substrate at sides of the gate electrode, forming a storage node electrode layer contacting one side of the impurity diffused region, forming a thermal nitride film on the storage node electrode layer, forming a Ta.sub.2 O.sub.5 layer on the thermal nitride film, and annealing the Ta.sub.2 O.sub.5 layer using an N.sub.2 O gas.
REFERENCES:
patent: 3466230 (1969-09-01), Carithers
patent: 4980307 (1990-12-01), Ito et al.
patent: 5248629 (1993-09-01), Muroyama
patent: 5254505 (1993-10-01), Kamiyama
patent: 5352623 (1994-10-01), Kamiyama
patent: 5443993 (1995-08-01), Park et al.
patent: 5622888 (1997-04-01), Sekine et al.
patent: 5641702 (1997-06-01), Imai et al.
patent: 5699291 (1997-12-01), Tsunemine
patent: 5726083 (1998-03-01), Takaishi
patent: 5763300 (1998-06-01), Park et al.
patent: 5786248 (1998-07-01), Schuegraft
Robert C. Weast "CRC Handbook of Chemistry and Physics", p., F90, Aug. 2, 1989.
S. C. Sun et al. " A New Post-Deposition Annealing Method Using Furnace N2O for the Reduction of Leakage Current of CVD Ta2O5 Storage Capacitors", IEEE, pp. (27. 4. 1)-(27. 4. 4), 1996.
S. C. Sun et al. " Leakage Current Reduction in Chemical-Vapor-Deposited Ta2O5 Films by Rapid Thermal Annealing in N2O", IEEE Elctron Device Letters, vol. 17, No. 17, pp. 355-357, Jul. 1996.
K. Naruke, S. Taguchi, and M. Wada, "Stress Induced Leakage Current Limiting to Scale Down EEPROM Tunnel Oxide Thickness", IEDM 1988, pp. 424-427.
G. W. Yoon, A. B. Joshi, J. Kim, and Dim Lee Kwong, "MOS Characteristics of NH.sub.3 --Nitrided N.sub.2 O--Grown Oxides", IEEE EDL 1993, vol. 14, pp. 179-181.
S. C. Sun and T. F. Chen, "A Novel Approach for Leakage Current Reduction of LPCVD Ta.sub.2 O.sub.5 and TiO.sub.2 Films by Rapid Thermal N.sub.2 O Annealing", IEDM, 1994, pp. 333-338.
Huh Yun Jun
Kim Sang Hyun
Oh Je Uk
Guerrero Maria
Jr. Carl Whitehead
LG Semicon Co. Ltd.
LandOfFree
Method of forming capacitor for semiconductor device using N.sub does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming capacitor for semiconductor device using N.sub, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming capacitor for semiconductor device using N.sub will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-168691