Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-12-13
2005-12-13
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S314000, C430S319000, C430S330000, C438S615000, C438S694000, C228S246000
Reexamination Certificate
active
06974659
ABSTRACT:
A method for protecting a semiconductor process wafer surface from contacting thermally degraded photoresist including providing a semiconductor process wafer having a process surface; forming a protective layer over selected areas of the process surface said protective layer including a resinous organic material having a glass transition temperature (Tg) that is about greater than a thermal treatment temperature; forming a photoresist layer over at least a portion of the protective layer to include a photolithographic patterning process; and subjecting the semiconductor process wafer to the thermal treatment temperature.
REFERENCES:
patent: 6137125 (2000-10-01), Costas et al.
patent: 6410414 (2002-06-01), Lee
Chen Li-Chih
Chen Yen-Ming
Ching Kai-Ming
Lee Hsin-Hui
Lin Chia-Fu
Huff Mark F.
Ruggles John
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Assoc.
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