Method of forming a nanowire and method of manufacturing a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S303000, C977S938000

Reexamination Certificate

active

07410853

ABSTRACT:
In a method of forming a nanowire in a semiconductor device, a trench is formed by partially etching a bulk semiconductor substrate. An insulation layer pattern is formed on the substrate to fill up the trench. The insulation layer pattern covers a first region of the substrate where the nanowire is formed, and additionally covers a second region of the substrate connected to the first region. An opening is formed by etching an exposed portion of the substrate by the insulation layer pattern. A spacer is formed on sidewalls of the opening and the insulation layer pattern. The nanowire connected to the second region is formed by anisotropically etching a portion of the substrate exposed by the opening until a portion of the insulation layer pattern formed in the trench is exposed.

REFERENCES:
patent: 5493136 (1996-02-01), Matsuzaki et al.
patent: 2005/0136585 (2005-06-01), Chau et al.
patent: 2007/0148857 (2007-06-01), Ban et al.
patent: 2007/0262344 (2007-11-01), Anwar et al.
patent: 06-140636 (1994-05-01), None
patent: 2002-110832 (2002-04-01), None
patent: 10-2004-0091309 (2004-10-01), None

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