Method of fabricating trench MIS device with graduated gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S268000, C438S269000, C438S271000, C438S272000, C438S273000, C438S274000

Reexamination Certificate

active

06875657

ABSTRACT:
A process for manufacturing a trench MIS device includes depositing a conformal nitride layer in the trench; etching the nitride layer to create an exposed area at the bottom of the trench; and heating the substrate and thereby growing an oxide layer in the exposed area. This process causes the mask layer to “lift off”, creating a “bird's beak” structure. This becomes a “transition region”, where the thickness of the oxide layer decreases gradually in a direction away from the exposed area. The method further includes diffusing a dopant into the substrate, the dopant forming a PN junction with a remaining portion of said substrate, and controlling the diffusion such that the PN junction intersects the trench in the transition region. Because the thickness of the oxide layer decreases gradually, the PN junction does not need to be located at a particular point, i.e., there is a margin of error. This improves the manufacturability of the device and enhances its breakdown characteristics.

REFERENCES:
patent: 4546367 (1985-10-01), Schutten et al.
patent: 4683643 (1987-08-01), Nakajima et al.
patent: 4914058 (1990-04-01), Blanchard
patent: 4967245 (1990-10-01), Cogan et al.
patent: 5424231 (1995-06-01), Yang
patent: 5442214 (1995-08-01), Yang
patent: 5473176 (1995-12-01), Kakumoto
patent: 5486714 (1996-01-01), Hong
patent: 5882971 (1999-03-01), Wen
patent: 5915180 (1999-06-01), Hara et al.
patent: 5976936 (1999-11-01), Miyajima et al.
patent: 6020600 (2000-02-01), Miyajima et al.
patent: 6074909 (2000-06-01), Gruening
patent: 6084264 (2000-07-01), Darwish
patent: 6144054 (2000-11-01), Agahi et al.
patent: 6291200 (2001-09-01), Williams
patent: 6291298 (2001-09-01), Williams et al.
patent: 6444528 (2002-09-01), Murphy
patent: 6569738 (2003-05-01), Darwish
patent: 20010026989 (2001-10-01), Thapat
patent: 0 801 426 (1997-10-01), None
patent: 1-192174 (1989-08-01), None
patent: 3-211885 (1991-09-01), None
patent: 6-21468 (1994-01-01), None
patent: 10032331 (1998-02-01), None
patent: 11026758 (1999-01-01), None
patent: 11-163342 (1999-06-01), None
patent: 2000269487 (2000-08-01), None
patent: 98-04004 (1998-01-01), None
patent: WO 0057481 (2000-09-01), None
European Patent Office, Patent Abstracts of Japan, vol. 013, No. 483 (E-839), Nov. 2, 1989 (Hitachi).
European Patent Office, Patent Abstracts of Japan, vol. 015, No. 486 (E-1143), Dec. 10, 1991 (Matsushita).
European Patent Office, Patent Abstracts of Japan, vol. 1999, No. 11, Sep. 30, 1999 (NEC Corp.).
U.S. Appl. No. 09/927,143, Darwish et al., filed Aug. 10, 2001.
U.S. Appl. No. 10/106,812, Darwish et al., filed Mar. 26, 2002.
European Patent Office, Abstract of Japan vol. 1999, No. 04, Apr. 30, 1999 (Fuji Electronic Co. Ltd.).
European Patent Office, Abstract of Japan vol. 2000, No. 12, Jan. 3, 2000, (Kaga Toshiba Electron KK).
European Patent Office, Abstract of Japan, vol. 1998, No. 06, Apr. 30, 1998, (Nec Corp).
European Patent Office, Abstract of Japan vol. 1999, No. 08, Jun. 30, 1999, (Toshiba Corp).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating trench MIS device with graduated gate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating trench MIS device with graduated gate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating trench MIS device with graduated gate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3416689

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.