Method of fabricating a semiconductor device, and...

Details Method of fabricating a semiconductor device, and... Method of fabricating a semiconductor device, and...

2011-03-29

2011-03-29

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S686000, C257S777000, C257SE23040

Reexamination Certificate

active

07915710

ABSTRACT:
A method of fabricating a semiconductor device includes providing a semiconductor substrate having an active surface, thinning the substrate by removing material from a second surface of the substrate opposite the active surface, bonding a metal carrier to the second surface of the thinned substrate, forming a via opening in the thinned substrate, forming a conductive member in the via opening, and patterning the metal carrier bonded to the second surface of the thinned substrate to form a metal pattern.

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