4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Physical configuration of semiconductor
  6. With electrical contact in hole in semiconductor

Eun Chul Ahn

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BGA package and method of manufacturing the same

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of fabricating a semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2311030

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