Method of fabricating a CMOS device with dual metal gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07316950

ABSTRACT:
A method of constructing a dual metal gate CMOS structure that uses an ultra thin aluminum nitride (AINx) buffer layer between the metal gate and gate dielectric during processing for preventing the gate dielectric from being exposed in the metal etching process. After the unwanted gate metal is etched away, the CMOS structure is annealed. During the annealing, the buffer layer is completely consumed through reaction with the metal gate and a new metal alloy is formed, resulting in only a minimal increase in the equivalent oxide thickness. The buffer layer and gate metals play a key role in determining the work functions of the metal/dielectric interface, since the work functions of the original gate metals are modified as a result of the annealing process.

REFERENCES:
patent: 5989950 (1999-11-01), Wu
patent: 6255204 (2001-07-01), Tobin et al.
patent: 6265302 (2001-07-01), Lim et al.
patent: 6352913 (2002-03-01), Mistry et al.
patent: 6653698 (2003-11-01), Lee et al.
patent: 7045406 (2006-05-01), Huotari et al.
patent: 2004/0106261 (2004-06-01), Huotari et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a CMOS device with dual metal gate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a CMOS device with dual metal gate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a CMOS device with dual metal gate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2748382

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.