Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-04-23
2010-11-16
Smoot, Stephen W (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S491000, C438S532000, C438S591000, C257SE21267
Reexamination Certificate
active
07833864
ABSTRACT:
Embodiments prevent or substantially reduce diffusion of a P-type impurity into a channel region in a PMOS transistor having a dual gate. Some embodiments include forming a device isolation film on a semiconductor substrate, forming a channel impurity region in an active region of the semiconductor substrate, and forming a gate insulation layer including a silicon oxide layer and a silicon oxide nitride layer on the semiconductor substrate. Also, the embodiments can include forming a polysilicon layer containing an N-type impurity on the gate insulation layer, and forming a gate electrode by selectively ion-implanting a P-type impurity into the polysilicon layer formed in a PMOS transistor region of the circuit region. The embodiments further include forming a conductive metal layer and a gate upper insulation layer on the gate electrode, and forming a gate stack in a gate region.
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Korean Office Action dated Sep. 22, 2005 issued in KR Application No. 2003-0057836.
Jang Se-Myeong
Jin Gyo-Young
Kim Wook-Je
Oh Yong-Chul
Son Nak-Jin
Samsung Electronics Co,. Ltd.
Smoot Stephen W
Stanzione & Kim LLP
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