Method of doping polysilicon layer that utilizes gate...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S491000, C438S532000, C438S591000, C257SE21267

Reexamination Certificate

active

07833864

ABSTRACT:
Embodiments prevent or substantially reduce diffusion of a P-type impurity into a channel region in a PMOS transistor having a dual gate. Some embodiments include forming a device isolation film on a semiconductor substrate, forming a channel impurity region in an active region of the semiconductor substrate, and forming a gate insulation layer including a silicon oxide layer and a silicon oxide nitride layer on the semiconductor substrate. Also, the embodiments can include forming a polysilicon layer containing an N-type impurity on the gate insulation layer, and forming a gate electrode by selectively ion-implanting a P-type impurity into the polysilicon layer formed in a PMOS transistor region of the circuit region. The embodiments further include forming a conductive metal layer and a gate upper insulation layer on the gate electrode, and forming a gate stack in a gate region.

REFERENCES:
patent: 6001677 (1999-12-01), Shimizu
patent: 6030874 (2000-02-01), Grider et al.
patent: 6184110 (2001-02-01), Ono et al.
patent: 6198121 (2001-03-01), Sung et al.
patent: 6387784 (2002-05-01), Chong et al.
patent: 6413881 (2002-07-01), Aronowitz et al.
patent: 6432780 (2002-08-01), Chen
patent: 6489210 (2002-12-01), Sohn et al.
patent: 6566281 (2003-05-01), Buchanan et al.
patent: 6657244 (2003-12-01), Dokumaci et al.
patent: 2002/0001899 (2002-01-01), Ito
patent: 2002/0068405 (2002-06-01), Ono
patent: 2003/0057499 (2003-03-01), Yamamoto et al.
patent: 2003/0092249 (2003-05-01), Hsu et al.
patent: 2004/0002226 (2004-01-01), Burnham et al.
patent: 2004/0004247 (2004-01-01), Forbes et al.
patent: 100266690 (2000-06-01), None
patent: 20020002155 (2002-01-01), None
Korean Office Action dated Sep. 22, 2005 issued in KR Application No. 2003-0057836.

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