Method of doping P-type impurity ions in dual poly gate and...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma

Reexamination Certificate

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C438S514000, C438S527000, C438S529000, C438S530000

Reexamination Certificate

active

08003501

ABSTRACT:
A method of doping p-type impurity ions in a dual poly gate, comprising: forming a polysilicon layer doped with n-type impurity ions on a substrate with a gate insulation layer being interposed between the polysilicon layer and the substrate; exposing a region of the polysilicon layer; implementing a first doping of p-type impurity ions into the exposed region of the polysilicon layer by ion implantation so with a projection range Rp to a predetermined depth of the polysilicon layer; and implementing a second doping of p-type impurity ions into the exposed region of the polysilicon layer doped with the p-type impurity ions by plasma doping with a sloped doping profile.

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patent: 10-2001-0004934 (2001-01-01), None
patent: 10-2007-0047639 (2007-05-01), None

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