Method of determining a dechucking voltage which nullifies a res

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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H02N 1300

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active

054916038

ABSTRACT:
The invention is embodied in a method of determining an optimum de-chucking voltage for nullifying residual electrostatic forces on a wafer in an electrostatic chuck for removal of the wafer from the chuck, including holding the wafer on the electrostatic chuck by applying an electrostatic potential to the chuck, introducing a gas between the wafer and the chuck, reducing the electrostatic potential of the chuck while observing a rate of leakage of the gas from between the wafer and the chuck, and recording as the optimum dechucking voltage the value of the electrostatic potential obtaining when the rate of leakage exceeds a predetermined threshold.

REFERENCES:
patent: 4565601 (1986-01-01), Kakehi et al.
patent: 4667110 (1987-05-01), Kariya
patent: 5221450 (1993-06-01), Hattori et al.
patent: 5270266 (1993-12-01), Hirano et al.
patent: 5315473 (1994-05-01), Collins et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 1, Jun. 1988, pp. 462-464, "Electrostatic Wafer Holder for Water Cooling During Reactive Ion Etching".

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