Method for varying x-ray hybrid resist space dimensions

X-ray or gamma ray systems or devices – Specific application – Lithography

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430967, G21K 500

Patent

active

06014422&

ABSTRACT:
The present invention provides combining the advantages of hybrid resist with the unique properties of x-ray lithography to form high tolerance devices with x-ray pitch and to provide a means for varying the space width and fine tuning to account for process variations. Accordingly, a space width in the hybrid resist can be selectively printed by varying the mask-wafer gap distance, allowing more versatile structures to be formed and adjustments to be made for process changes such as resist composition and ion implant levels.

REFERENCES:
patent: 5776660 (1998-07-01), Hakey et al.
patent: 5861330 (1999-01-01), Baker et al.
patent: 5882967 (1999-03-01), Brown et al.
patent: 5939767 (1999-08-01), Brown et al.

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