Method for the wet-chemical treatment of a semiconductor wafer

Details Method for the wet-chemical treatment of a semiconductor wafer Method for the wet-chemical treatment of a semiconductor wafer

2008-12-03

2011-12-06

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

C134S001000, C134S001300, C134S004000

Reexamination Certificate

active

08070882

ABSTRACT:
A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 μm or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.

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