Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2011-01-04
2011-01-04
Alanko, Anita K (Department: 1713)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C216S041000, C216S046000, C216S049000, C216S057000, C216S067000, C216S079000, C216S099000, C438S052000, C438S053000, C438S696000, C438S700000, C438S704000, C438S719000, C438S739000, C438S753000
Reexamination Certificate
active
07862731
ABSTRACT:
To form an isolation structure in a semiconductor substrate, at least two trenches are formed with a rib therebetween in the semiconductor substrate, and then the semiconductor material in the area of the trenches and particularly the rib is converted to an electrically insulating material. For example, this is accomplished by thermal oxidation of silicon semiconductor material of the rib.
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Aikele Matthias
Engelhardt Albert
Frey Marcus
Schmid Bernhard
Seidel Helmut
Alanko Anita K
Conti Temic microelectronic GmbH
Fasse W. F.
Fasse W. G.
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