Method for producing insulation structures

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

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C216S041000, C216S046000, C216S049000, C216S057000, C216S067000, C216S079000, C216S099000, C438S052000, C438S053000, C438S696000, C438S700000, C438S704000, C438S719000, C438S739000, C438S753000

Reexamination Certificate

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07862731

ABSTRACT:
To form an isolation structure in a semiconductor substrate, at least two trenches are formed with a rib therebetween in the semiconductor substrate, and then the semiconductor material in the area of the trenches and particularly the rib is converted to an electrically insulating material. For example, this is accomplished by thermal oxidation of silicon semiconductor material of the rib.

REFERENCES:
patent: 5041898 (1991-08-01), Urabe et al.
patent: 5179499 (1993-01-01), MacDonald et al.
patent: 5426070 (1995-06-01), Shaw et al.
patent: 5506175 (1996-04-01), Zhang et al.
patent: 5628917 (1997-05-01), MacDonald et al.
patent: 5747377 (1998-05-01), Wu
patent: 5869354 (1999-02-01), Leedy
patent: 5930595 (1999-07-01), Sridhar et al.
patent: 5963789 (1999-10-01), Tsuchiaki
patent: 6239473 (2001-05-01), Adams et al.
patent: 6307247 (2001-10-01), Davies
patent: 6342427 (2002-01-01), Choi et al.
patent: 6461888 (2002-10-01), Sridhar et al.
patent: 6551944 (2003-04-01), Fallica et al.
patent: 6573154 (2003-06-01), Sridhar et al.
patent: 6767614 (2004-07-01), Hofmann et al.
patent: 6969628 (2005-11-01), Bertz et al.
patent: 7540192 (2009-06-01), Takeuchi et al.
patent: 2001/0013630 (2001-08-01), Cho et al.
patent: 2002/0001871 (2002-01-01), Cho et al.
patent: 2004/0198063 (2004-10-01), Subramanian et al.
patent: 2007/0042606 (2007-02-01), Wang et al.
Chunbo Zhang et al.; “Fabrication of thick silicon dioxide layers using DRIE, oxidation and trench refill”; IEEE, 2002, pp. 160-163, XP010577620.

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