Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2007-03-06
2007-03-06
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S532000, C438S918000
Reexamination Certificate
active
11201843
ABSTRACT:
Provided is a method for manufacturing a semiconductor device comprising forming a device isolation layer on a semiconductor substrate; forming gate insulating layers on the upper part of the semiconductor substrate having the device isolation layers formed thereon; forming an undoped layer for a gate electrode; implanting mixed dopant ions consisting of at least two dopant ions containing11B ions into the undoped layer, utilizing an ion-implantation mask; and heat-treating the mixed dopant ion-implanted layer.
REFERENCES:
patent: 4698900 (1987-10-01), Esquivel
patent: 4713329 (1987-12-01), Fang et al.
patent: 4895520 (1990-01-01), Berg
patent: 4931411 (1990-06-01), Tigelaar et al.
patent: 5151374 (1992-09-01), Wu
patent: 5267194 (1993-11-01), Jang
patent: 5354700 (1994-10-01), Huang et al.
patent: 5464782 (1995-11-01), Koh
patent: 5534451 (1996-07-01), Wuu et al.
patent: 5554854 (1996-09-01), Blake
patent: 5913131 (1999-06-01), Hossain et al.
patent: 2001/0016389 (2001-08-01), Wang et al.
patent: 2002/0027804 (2002-03-01), Wong
patent: 2002/0096706 (2002-07-01), Rudeck et al.
patent: 2004/0028468 (2004-02-01), Wappes et al.
patent: 2004/0185620 (2004-09-01), Rudeck et al.
patent: 2004/0232609 (2004-11-01), Stefanoni
patent: 2005/0164461 (2005-07-01), Chen et al.
patent: 2005/0250240 (2005-11-01), Hong et al.
patent: 1020000007411 (2000-02-01), None
patent: 1020030054050 (2003-07-01), None
patent: 1020040026332 (2004-03-01), None
Jin Seung Woo
Lee Min Yong
Rouh Kyoung Bong
Fourson George
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
LandOfFree
Method for manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3744954