Method for making a semiconductor multi-package module...

Details Method for making a semiconductor multi-package module... Method for making a semiconductor multi-package module...

2007-07-24

2007-07-24

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C257S686000, C257S687000, C257S724000, C257S784000, C257SE25006

Reexamination Certificate

active

11337944

ABSTRACT:
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

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