Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2004-05-18
2009-11-24
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S761000, C438S788000, C257SE21276, C257SE21277
Reexamination Certificate
active
07622400
ABSTRACT:
Methods of forming a dielectric layer having a low dielectric constant and high mechanical strength are provided. The methods involve depositing a sub-layer of the dielectric material on a substrate, followed by treating the sub-layer with a plasma. The process of depositing and plasma treating the sub-layers is repeated until a desired thickness has been reached.
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Fox Keith
Mordo David
Srinivasan Easwar
Wu Qingguo
Jefferson Quovaunda
Novellus Systems Inc.
Smith Matthew
Weaver Austin Villeneuve & Sampson LLP
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