Method for forming pillar memory cells and device formed thereby

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438270, 438392, 438561, H01L 218242

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active

060965983

ABSTRACT:
The preferred embodiments of the present invention overcome the limitations of the prior art by providing a method for forming the source/drain diffusions in a vertical transistor structure that results in improved channel length uniformity. In one embodiment, the present invention is used to form source/drain and bitline diffusion structures for use in pillar memory cells. Additionally, in another embodiment, the present invention is used to form source/drain and plate diffusion structures in pillar memory cells. Both preferred embodiments deposit conformal photoresist on a pillar structure and use an off-axis exposure process to recess a dopant source layer to the proper depth along the pillar. The recessed dopant source layer can then be used to form the source/drain/bitlines diffusions or source/drain/plate diffusions in the pillar memory device.

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