Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-06-27
1999-10-05
Tsai, Jey
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438398, H01L 218242
Patent
active
059638052
ABSTRACT:
A method for forming an integrated circuit capacitor includes the steps of forming a first electrode layer on a substrate wherein the first electrode has a first dopant concentration, and forming a second electrode layer on the first electrode layer opposite the substrate. The second electrode layer has a second dopant concentration different from the first dopant concentration. In addition, a portion of the second electrode layer is converted to a hemispherical grain layer. More particularly, the first dopant concentration is greater than the second dopant concentration. Related structures are also discussed.
REFERENCES:
patent: 5234862 (1993-08-01), Aketagawa et al.
patent: 5366917 (1994-11-01), Watanabe et al.
patent: 5372962 (1994-12-01), Hirota et al.
patent: 5385863 (1995-01-01), Tatsumi et al.
patent: 5394012 (1995-02-01), Kimura
patent: 5405801 (1995-04-01), Han et al.
patent: 5447878 (1995-09-01), Park et al.
patent: 5464791 (1995-11-01), Hirota
patent: 5486488 (1996-01-01), Kamiyama
patent: 5543347 (1996-08-01), Kawano et al.
patent: 5554557 (1996-09-01), Koh
patent: 5567637 (1996-10-01), Hirota
patent: 5590051 (1996-12-01), Yokozawa
patent: 5595937 (1997-01-01), Mikagi
patent: 5597754 (1997-01-01), Lou et al.
patent: 5616511 (1997-04-01), Hirota
patent: 5623243 (1997-04-01), Watanabe et al.
patent: 5639689 (1997-06-01), Woo
H. Watanabe et al., A New Cylindrical Capacitor Using Hemispherical Grained Si (HSG-Si) for 256Mb DRAMs, IEDM 92-259-262, 1992 IEEE, pp. 10.1.1-10.1.14 (No Month).
Ahn Seung-joon
Kang Man-sug
Samsung Electronics Co,. Ltd.
Tsai Jey
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