Method for forming gate dielectric layer

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S591000, C438S758000, C438S787000

Reexamination Certificate

active

07662683

ABSTRACT:
Provided is a method for forming a gate dielectric layer, in which a plasma oxide layer is finely formed by plasma at a temperature of 200° C. or below, and an atomic layer deposition (ALD) oxide layer is deposited. Further, the gate dielectric layer according to the present invention can be applied to a display device comprising a substrate such as a plastic substrate vulnerable to heat, have good interfacial characteristic, and allow a high dielectric layer to be applied thereto.

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Yong Woo Choi, et al.; “Effects of inductively coupled plasm oxidation on the properties of poly crystalline silicon films and thin film transistor”; Applied Physics Letters; vol. 74, No. 18; May 3, 1999; pp. 2693-2695.

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