Method for forming BJT via formulation of high voltage device in

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438202, 438203, 438205, 257370, H01L 218238

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active

061177180

ABSTRACT:
A method for forming bipolar junction transistor with high gain via formulation of high voltage device in deep submicron process is disclosed. A substrate including a first part, a second part, and a third part is primarily provided; then, a first well in the first part and a second well in the second part are formed. A plurality of field oxide regions are formed on said substrate; subsequently, two third wells are formed in said third part. The following steps are to form a fourth well in said first well in said first part and two fifth wells in said second well in said second part; and to form a first gate on said first part between said two third wells, and a second gate on said second part between said two fifth wells. Next, a first spacer against said first gate and a second spacer against said second gate are formed. Further, first ions are introduced into said first part to serve as a collector region, and into said third part to serve as a first source/drain region. Finally, second ions are introduced into said first part to form an emitter region and a base region of a bipolar junction transistor, and into said second part to form a second source/drain region.

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patent: 4956305 (1990-09-01), Arndt
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patent: 5439833 (1995-08-01), Hebert et al.
patent: 5506156 (1996-04-01), Watanabe et al.
patent: 5780329 (1998-07-01), Randazzo et al.

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