Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2011-01-04
2011-01-04
Duda, Kathleen (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S327000
Reexamination Certificate
active
07862987
ABSTRACT:
An electrical structure and method of forming. The method comprises providing a substrate structure. A first layer comprising a first photosensitive material having a first polarity is formed over and in contact with the substrate structure. A second layer comprising photosensitive material having a second polarity is formed over and in contact with the first layer. The first polarity comprises an opposite polarity as the second polarity. Portions of the first and second layers are simultaneously exposed to a photo exposure light source. The portions of the first and second layers are developed such that structures are formed.
REFERENCES:
patent: 4533624 (1985-08-01), Sheppard
patent: 4567132 (1986-01-01), Fredericks et al.
patent: 4606998 (1986-08-01), Clodgo et al.
patent: 6398430 (2002-06-01), Jeoung et al.
patent: 6586323 (2003-07-01), Fan et al.
patent: 6958546 (2005-10-01), Fan et al.
patent: 2007/0059650 (2007-03-01), Nagahara et al.
Daubenspeck Timothy Harrison
Gambino Jeffrey Peter
Muzzy Christopher David
Sauter Wolfgang
Duda Kathleen
International Business Machines - Corporation
Kotulak Richard M.
Schmeiser Olsen & Watts
Sullivan Caleen O
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