Method for forming a high-k dielectric stack

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S778000, C438S785000

Reexamination Certificate

active

07465626

ABSTRACT:
The present invention provides a method for fabricating a dielectric stack in an integrated circuit comprising the steps of (i) forming a high-k dielectric layer on a semiconductor substrate, (ii) subjecting the semiconductor substrate with the high-k dielectric layer to a nitrogen comprising vapor phase reactant and silicon comprising vapor phase reactant in a plasma-enhanced chemical vapor deposition process (PECVD) or a plasma-enhanced atomic layer chemical vapor deposition (PE ALCVD) process. Furthermore, the present invention provides a dielectric stack in an integrated circuit comprising (i) a high-k dielectric layer comprising at least a high-k material, (ii) a dielectric layer comprising at least silicon and nitrogen; (iii) an intermediate layer disposed between the high-k dielectric layer and the dielectric layer, the intermediate layer comprising the high-k material, silicon, and nitrogen.

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Allaert, K. et al.,A Comparison Between Silicon Nitride Films Made by PCVD of N2-SIH4/AR amd N2-SIH4/HE, Journal of the Electrochemical Society Electrochemical Society vol. 132 No. 7 Jul. 1985 pp. 1763-1766l; XP000840429.

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