Method for forming a device having multiple silicide types

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S655000, C438S664000

Reexamination Certificate

active

07112483

ABSTRACT:
Provided is a semiconductor device and a method for its fabrication. The device includes a semiconductor substrate, a first silicide in a first region of the substrate, and a second silicide in a second region of the substrate. The first silicide may differ from the second silicide. The first silicide and the second silicide may be an alloy silicide.

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Kedzierski et al., “Metal-gate FinFET and fully-depleted SOI devices using total gate silicidation”, 2002, 4 pages, 0-7803-7463-X/02, IEEE.
Kedzierski et al., “Design analysis of thin-body silicide source/drain devices”, Oct. 1, 2001, pp. 21-22, 0-7803-6739-1/01, IEEE International SOI Conference.
Kedzierski et al., “Complementary silicide source/drain thin-body MOSFETs for the 20nm gate length regime”, 2000, pp. 3.4.1-3.4.4, 07-7803-6438-4, IEEE.
“Bulk Silicon Technology for Complementary MESFETs”, Apr. 27, 1989, pp. 565-566, vol. 25, No. 9, Electronics Letters.

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