Method for fabricating semiconductor device with fully...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S157000, C438S197000, C438S283000, C257SE21199, C257SE21438, C257SE21622

Reexamination Certificate

active

07977194

ABSTRACT:
A method for fabricating a semiconductor device includes the steps of: forming a first MISFET including first source/drain regions and a first gate electrode of a polycrystalline silicon, and a second MISFET including second source/drain regions and a second gate electrode of a polycrystalline silicon and having a gate length larger than that of the first gate electrode; and substituting the polycrystalline silicon forming the first and the second gate electrodes with a metal silicide. In the step of substituting the polycrystalline silicon with the metal silicide, the polycrystalline silicon forming the first gate electrode is totally substituted with the metal silicide and a part of polycrystalline silicon forming the second gate electrode is substituted with the metal silicide by utilizing that the gate length of the second gate electrode is larger than the gate length of the first gate electrode.

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Office Action—mailed by the State Intellectual Property Office of the People's Republic of China in connection with corresponding CN patent application No. 2006100092136, on Jul. 25, 2008.
Second Office Action, issued by the State Intellectual Property Office of the People's Republic of China, in connection with corresponding CN application No. 200610009213.6, on Feb. 5, 2010. English-language translation provided.

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