Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor
Reexamination Certificate
2005-03-01
2005-03-01
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Polycrystalline semiconductor
C438S308000, C438S482000, C438S795000
Reexamination Certificate
active
06861339
ABSTRACT:
Within a method for forming a silicon layer, there is employed at least one sub-layer formed of a higher crystalline silicon material and at least one sub-layer formed of a lower crystalline silicon material. The lower crystalline silicon material is formed employing a hydrogen treatment of the higher crystalline silicon material. The method is particularly useful for forming polysilicon based gate electrodes with enhanced dimensional control and enhanced performance.
REFERENCES:
patent: 4224084 (1980-09-01), Pankove
patent: 4285762 (1981-08-01), Moustakas
patent: 5710454 (1998-01-01), Wu
patent: 5739043 (1998-04-01), Yamamoto
patent: 6013577 (2000-01-01), Kimizuka
patent: 6159810 (2000-12-01), Yang
patent: 6162716 (2000-12-01), Yu et al.
patent: 6188104 (2001-02-01), Choi et al.
patent: 6287944 (2001-09-01), Hara et al.
patent: 20010023971 (2001-09-01), Kondo et al.
patent: 20020013114 (2002-01-01), Ohtani et al.
Chen Chia-Lin
Chen Shih-Chang
Yao Liang-Gi
Malsawma Lex H.
Smith Matthew
Taiwan Semiconductor Manufacturing Co. Ltd
Tung & Associates
LandOfFree
Method for fabricating laminated silicon gate electrode does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating laminated silicon gate electrode, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating laminated silicon gate electrode will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3456809