Method for fabricating field effect transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

10919416

ABSTRACT:
Provided is a method for fabricating a filed effect transistor, the method comprising: depositing a first semiconductor layer and a second semiconductor layer on a substrate in sequence, which have a different bandgap from each other, and patterning the second semiconductor layer to have a mesa structure; forming a first resist pattern to expose the second semiconductor layer of a region where source and drain are to be formed; depositing a metal on a whole upper surface, and forming metallic source and drain by performing a lift-off process; performing heat treatment to form an ohmic contact between the source and the second semiconductor layer, and between the drain and the semiconductor layer; forming an insulating layer on the whole upper surface including the source and the drain, and forming a second photoresist pattern to expose the insulating layer at a portion where a gate is to be formed; exposing the second semiconductor layer at the portion where the gate is to be formed by etching the exposed portion of the insulating layer; and depositing the metal on the whole upper surface in a state that the temperature of the substrate is lowered to perform low temperature vacuum deposition, and forming a metallic gate by performing a lift-off process and an insulating layer removing process.

REFERENCES:
patent: 5500381 (1996-03-01), Yoshida et al.
patent: 6756605 (2004-06-01), Reed et al.
patent: 1020030062792 (2003-07-01), None
Hong et al.; “Cryogenic Processed Metal-Semiconductor-Metal (MAM) Photodetectors on MBE Grown ZnSe”; IEEE Transactions on Electron Devices; Jun. 1999; pp. 1127-1134.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating field effect transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating field effect transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating field effect transistor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3840151

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.