Method for fabricating capacitor in integrated circuit

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438238, 438239, 438253, 438396, 438398, H01L 218234

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active

061566004

ABSTRACT:
A method for fabricating a capacitor in an integrated circuit, using tantalum oxide as the dielectric layer to obtain a higher capacitance. A barrier layer is formed between the polysilicon layer and the tantalum oxide layer to prevent the formation of a silicon oxide layer. Thus, that capacitance of the capacitor is not reduced by the additional thickness of the silicon oxide layer.

REFERENCES:
patent: 4995043 (1991-02-01), Kuwata et al.
patent: 5256455 (1993-10-01), Numasawa
patent: 5274485 (1993-12-01), Narita et al.
patent: 5508223 (1996-04-01), Tseng
patent: 5843821 (1998-12-01), Tseng
patent: 5913129 (1999-06-01), Wu et al.
patent: 5937307 (1999-08-01), Jenq et al.
patent: 5994181 (1999-11-01), Hsieh et al.
patent: 6001741 (1999-12-01), Alers

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